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| When semiconductor is finished, the next process is operation check. Formerly, first we need to wire and after it becomes package, we operate the check. If wired to end terminal we can do the checking, but that process is very wasteful. Because there is a risk of packaging failed chip. So we do the operation check as chips. Touching the surface of the chip with probe and connected it with a circuit tester. For semiconductor with very narrow line width, it is necessary to narrow the pitch of probe. To narrow the pitch, fine probe is imperative. |
 The diameter of probe is 0.11mm (see picture), pitch is 15mm. With diameter 11mm, inside diameter 0.088mm, a pivot for contact is protruded on both sides of a tube and inside there is a coil spring. There is a reason for having pivot on both sides.
For a general socket, there is a contact on one side and wiring is connected to the other side. If pitch is 0.15mm, there is no room for connecting each wire so we must place printed board at the other side of a chip to be tested. And by using the pattern, we take out the wire from broader are. Thus we use a block with numerous contact probe (at most 6000 pins) which is attached to the front of printed board as a testing head. One side of the probe is contacted with a work for testing and the other side with the printed board of testing head. |
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